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Tirpak Thomas M. (Motorola Home & Networks Mobility Business)
Developing and Deploying Electronics Assembly Line Optimization Tools : a Motorola Case Study
Decision Making in Manufacturing and Services, 2008, vol. 2, nr 1/2, s. 63-78, rys., tab., bibliogr. 12 poz.
Słowa kluczowe
Rynki elektroniczne, Maszyny i urządzenia, Optymalizacja, Studium przypadku
Electronic markets, Machinery and equipment, Optimalization, Case study
The assignment of workloads to production equipment is one category of planning decision for an electronics assembly factory. In practice, line balancing requires not only selecting machines with sufficient placement accuracy and feeder capacity, but also address- ing a host of other operational objectives and constraints. Motorola Labs led a multi-year effort to apply mathematical programming to balance a variety of production mix and volume scenarios. By representing the optimization problem as a specially structured, mixed linear-integer program, we were able to incorporate a high degree of reality in the model, simultaneously optimizing fixed setups, handling custom parts, maximizing machine uptime, and mitigating secondary bottlenecks. This paper presents the story of how we developed and deployed a software solution that significantly improved assembly cycle times, setup changeovers, and overall factory productivity, saving the company tens of millions of dollars.(original abstract)
Pełny tekst
  1. Csaszar P.C., Nelson P.C., Rajbhandari R.R., Tirpak T.M., 2000: Optimization of Automated High Speed Modular Placement Machines Using Knowledge-Based Systems. IEEE Trans. on Systems, Man, and Cybernetics Part C: Applications and Reviews, Vol. 30, No. 4, pp. 408-417.
  2. DePuy G.W., 1995: Component Allocation to Balance Workload in Printed Circuit Card Assembly Systems. Ph.D. Thesis. Georgia Institute of Technology, Atlanta, GA.
  3. Hopp W.A., Spearman M.L., 2000: Factory Physics Second Edition. McGraw-Hill/Irwin, Boston MA.
  4. Kaczmarczyk W., Sawik T., Schaller A., Tirpak T.M., 2004: Optimal Versus Heuristic Scheduling of Surface Mount Technology Lines. International Journal of Production Research, vol. 42 (10), pp. 2083-2110.
  5. McGinnis L.F., Ammons J.C., Carlyle M., Cranmer L., DePuy G.W., Ellis K.P., Tovey A., Xu H., 1992: Automated Process Planning for printed Circuit Card Assembly. IIE Transactions, Vol. 24, No. 4, pp. 18-30.
  6. Rothhaupt A., 1995: Modulares Planungssystem zur Optimierung der Elektronikfertigung. Carl Hanser Publishers, Munich.
  7. Sawik T., 1999: Production Planning and Scheduling in Flexible Assembly Systems. Springer-Verlag, Berlin, Germany, pp. 113-116.
  8. Sawik T., Schaller A., Tirpak T.M., 2002: Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines. Journal of Electronics Manufacturing, special issue on Production Planning and Scheduling in Electronics Manufacturing, vol. 11 (1), pp. 1-17.
  9. Tirpak T.M., 1993: Simulation Software for Surface Mount Assembly. Proc. of the 1993 Winter Simulation Conference. Los Angeles, CA, pp. 796-803.
  10. Tirpak T.M., 2000: Design-to-Manufacturing Information Management for Electronics Assembly. International Journal of Flexible Manufacturing Systems, Vol. 12, Issue2/3, pp. 189-205.
  11. Tirpak T.M., Mohapatra P.K., Nelson P.C., Rajbhandari R.R., 2002: A Generic Classifi- cation and Object-Oriented Simulation Toolkit for SMT Assembly Equipment. IEEE Trans. on Systems, Man, and Cybernetics - Part A: Systems and Humans, Vol. 32, No. 1, pp. 104-122.
  12. Van de Vall L., 1998: Optimizing an SMT Line. Surface Mount Technology Magazine, pp. 48-52.
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